Musk's Terafab Eyes Aggressive 1 Million Monthly Wafers by 2032
The Tesla and SpaceX joint venture has begun approaching equipment suppliers about ramping up production to rival Samsung's memory output, with procurement teams already seeking rapid delivery timelines from Japanese toolmakers.
Terafab, the semiconductor manufacturing venture backed by Elon Musk through Tesla and SpaceX, has begun informal discussions with equipment suppliers about reaching 1 million wafers monthly after 2032, according to Financial News. The company's procurement division has already traveled to Japan to request accelerated delivery schedules from equipment manufacturers.
The production roadmap allocates roughly 70 percent of total output—approximately 700,000 wafers—toward memory chip manufacturing, with the remaining 300,000 wafers designated for logic chips. If realized, the memory-focused portion would approach Samsung's current DRAM production capacity.
Industry estimates place Samsung's DRAM manufacturing capacity at between 650,000 and 700,000 wafers monthly, while SK hynix operates at roughly 550,000 wafers per month and has set a 2030 target of 1 million. The comparison requires nuance, however: Terafab's 700,000-wafer memory target encompasses all memory types, including both NAND and DRAM, whereas the Samsung and SK hynix figures refer exclusively to DRAM production. Even so, Terafab's projected memory output would exceed SK hynix's Wuxi facility in China, which reportedly produces around 200,000 wafers monthly, by more than threefold.