Intel advances U.S. fab buildout with Arizona tool installation and Ohio progress
Intel has begun equipping its Arizona fabrication plant and is advancing its Ohio manufacturing complex, positioning itself ahead of competitors in domestic semiconductor production.
Intel's domestic semiconductor footprint is gaining ground on rivals. The chipmaker announced Wednesday that equipment installation has commenced at Fab 62 in Arizona, with the facility expected to reach mass production capacity by the end of 2028. Simultaneously, the company is making headway on its Ohio One manufacturing site and has incorporated High-NA EUV lithography into high-volume manufacturing operations. Intel is also deepening its commitment to stateside research and development in cutting-edge process technology, advanced packaging, and photomask fabrication.
There is an important difference between technologies made in America and technologies that are truly American-made. The difference lies in the research and development process that transforms ideas into manufacturable technologies.
Naga Chandrasekaran, executive vice president and chief technology and operations officer, Intel Foundry