Chips

Frore Systems launches diamond-surface cooling for Nvidia Rubin, targeting 2,300W AI chips

A specialized liquid-cooling coldplate with diamond-infused technology aims to manage extreme heat densities in next-generation AI accelerators, potentially cutting GPU temperatures by as much as 22 degrees Celsius.

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Diamond-infused watercooling coldplates for 2,300W Nvidia Rubin drop temps by up to 22C

Frore Systems has unveiled the LiquidJet Diamond line of custom-engineered liquid-cooling coldplates, engineered to manage thermal challenges in high-performance AI accelerators. The technology pairs a diamond-based surface with a multi-stage 3D short-loop jet-channel microstructure designed to address localized heat concentrations on processors including AMD's Instinct MI400 and MI500-series chips, Nvidia's Rubin, and future generations.

According to Frore Systems, the LiquidJet Diamond coldplates can dissipate hotspots reaching power densities of 770 W/cm². The company reports temperature reductions of up to 22C relative to standard cooling solutions, alongside efficiency gains that could boost AI token throughput per watt by as much as 35%.

The LiquidJet Diamond represents an evolution of Frore Systems' cooling portfolio, building on its original LiquidJet coldplate and the LiquidJet Nexus bespoke solution developed for Nvidia Blackwell and Rubin-based server configurations. While Nexus consolidates multiple coldplates into a unified cooling assembly for multiple processors, LiquidJet Diamond functions as a dedicated single-GPU coldplate, though still tailored to specific hardware requirements.

Source: Tom's Hardware · Reporting supplemented by The Silicon Ledger staff.